High-speed Epoxy Die Bonding Machine
The FastStar Series is a series of high-speed and high-precision Die Attach Equipments designed for multi-chip packaging. With our self-developed motion control technology, those equipments can achiev...
Reciprocating RGV
Bozhon smart warehouse logisticsRGV equipment in functional is similar with the conveyor equipment,used mainly for the control system to realize the horizontal delivering function.At present, the RGV ...
Semiconductor Manufacturing Equipment
BOZHON Precision is mainly committed to the research and development, production, and sales of high-precision epoxy and eutectic die bonding equipment, as well as AOI inspection equipment in the field of semiconductor process equipment. The company continues to carry out innovative research and development, continuously deepening its expertise in the fields of high-speed and high-precision mounting and AOI inspection, providing ‘BOZHON wisdom’ for the industry, and promoting the development of advanced semiconductor processes and industrial upgrading.
FCT Functional Testing Machine
Bo Zhon FCT functional Testing Machine the production line is suitable for: laptop motherboards, server motherboards, telephone motherboards (pin point, TYPE-C, interface test, LED lights, current, vo...
Prismatic Battery Electrolyte Filling Machine
Prismatic Battery Electrolyte Filling Machine It is applicable to fully automatic electrolyte injection for Square Battery batch production,and can achieve functions of cell feeding, shaping, code sca...
Chip Packing AOI Machine
The CesiStar Series is a series of high-speed and high-precision fully automatic visual inspection equipments that use optical principles to detect chip defects. It is widely used in the research, dev...
AGV
Bozhon smart warehouse logistics AGV equipment mainly includes latent AGV, forklift AGV, backpack AGV, CTU and so on.The AGV application scene is more flexible, mainly with high requirements on the wa...