The Suzhou Optical Communication Industry Innovation and Development Summit and Bozhon Precision Machinery's New Product Launch for the Fully Automatic High-Precision Eutectic Die Bonder were Successfully Held in Suzhou

On December 16th, the Suzhou Optical Communication Industry Innovation and Development Summit and the New Product Launch of Bozhon Precision Machinery's DB3000 Fully Automatic High-Precision Eutectic Die Bonder, organized by the Suzhou Optical Communication Industry Alliance and Bozhon Precision Machinery Co., Ltd., and guided by the Suzhou Municipal Bureau of Industry and Information Technology and the Wujiang District Bureau of Industry and Information Technology, were successfully held at the Tongli Lakeview Hotel in Suzhou.

Government leaders including Liu Ziyin, Director of the Electronic Information Industry Department of Suzhou Municipal Bureau of Industry and Information Technology, and Chen Jiangang, Deputy Director-General of Wujiang District Bureau of Industry and Information Technology; representatives from industry associations such as the Communication Cable and Optical Cable Committee of China Communication Enterprises Association, Suzhou Optoelectronic Industry Chamber of Commerce, Suzhou Communication Industry Association, Yangtze River Delta G60 Science and Innovation Corridor Laser Industry Alliance, Suzhou Optical Communication Industry Alliance; heads of core enterprises in the photonics industry innovation cluster such as China Inspection and Certification Group, Yongding Group, Hengtong Group, Huawei Technologies; and company leaders including Ms. Wang Xinhua, CEO of Bozhon Precision Machinery, Mr. Yu Song, Vice President, and Mr. Meng Jian, Director of R&D Center, attended the summit.

Before the summit began, the attendees collectively visited the Bozhon Precision Machinery Technology Park. They focused on visiting the Bozhon exhibition hall and the new product line of the DB3000 fully automatic high-precision eutectic die bonder, gaining a detailed understanding of Bozhon's development history, business scope, corporate culture, and the production process of the DB3000 fully automatic high-precision eutectic die bonder.

The summit was opened with a speech by Ms. Wang Xinhua, CEO of Bozhon Precision Machinery. She stated that Bozhon Precision Machinery has been deeply involved in the field of equipment manufacturing for over twenty years. This conference serves as a periodic summary of the development of Bozhon Precision Machinery. She believes that, with the care of government leaders at all levels and the support of various industry associations, Bozhon Precision Machinery will achieve even better development in the future.

Subsequently, Mr. Feng Feng, the Executive Secretary-General of the Suzhou Optoelectronic Industry Chamber of Commerce, introduced the development of the photonics industry in China and the historical background of the Photonics Alliance.

In his speech, Deputy Director Chen Jiangan of the Wujiang Bureau of Industry and Information Technology stated that the 21st century is the century of light, and the photonics industry represents the information age. Wujiang District will fully leverage its industrial advantages to vigorously promote mutual cooperation among photonics-related enterprises in Wujiang District, aiming to build a new high ground for the photonics industry in Wujiang.

In his speech, Director Liu Ziyin of the Suzhou Municipal Bureau of Industry and Information Technology discussed that Suzhou places great emphasis on the development of the photonics industry, has introduced a series of policies to support the photonics industry cluster, and is fully committed to developing directions such as optical communication, optical manufacturing, optical display, and optical medicine, striving to create a national model area for the photonics industry.

Mr. Yu Jun from Bozhon Precision Machinery reported to the attendees on the development history and business scope of Bozhon Precision Machinery.

During the new product launch segment, Mr. Zhang Genfu from Bozhon Precision Machinery gave a detailed introduction of the DB3000 fully automatic high-precision eutectic die bonder, which was developed by the Bozhon Precision Machinery R&D team over two and a half years. The DB3000 is a fully automatic high-precision eutectic die bonder that first achieves precise alignment between the chip and the base, and then uses eutectic or die bonding processes to achieve the chip's fixation and electrical connection to the base. It is suitable for packaging such as CoC, CoB, CoS, etc., and is mainly used for the R&D and mass production of optical communication devices, MEMS devices, RF devices, microwave devices, and more. The performance of this equipment is on par with the international top level and has broken the foreign monopoly in this field to a certain extent, achieving domestic substitution to some degree.

The DB3000 boasts three major advantages. First, high precision, achieved through continuous improvements in key technologies such as the air floatation system, vision system, and automatic control software. It has reached a mounting precision of ±2μm@3σ for glass slides and can guarantee a mounting precision of ±3μm@3σ for general materials. Globally, a mounting precision of ±3μm@3σ is considered a high level. Second, high productivity, the equipment features multiple workstations, as well as rapid and precise temperature and force control functions, making it suitable for high-capacity applications. The standard eutectic heating temperature is 340°C, but this equipment can reach 500°C, making it more suitable for thicker carrier materials. To improve work efficiency, the DB3000 has a very high rate of temperature increase and decrease, being able to cool down from 340°C to 200°C within 5 seconds. In terms of force control, its precision can reach about 2g. Third, high flexibility, it supports various supply methods such as wafer blue tape, Waffle Pack, and Gel Pack. It can handle both optical chips and resistors/capacitors. Another aspect of its flexibility is that it supports both eutectic and dipping processes, as well as flip-chip bonding, with quick changes to the corresponding components.

Later on, Dean Li Shunfeng from Changguang Huaxin/Suzhou Semiconductor Laser Innovation Research Institute will deliver a report on innovation in the photonics industry. In his report, he will provide detailed information on the application areas of the photonics industry, outstanding enterprises, market size, and future development trends.

Secretary-General Chen Changjun of the Yangtze River Delta G60 Science and Innovation Corridor Laser Industry Alliance discussed the application areas of optical communication, practical cases, advantages of laser communication, and the scale of the industry.

Finally, Ms. Zhang Jinpei, the Deputy Secretary-General of the Suzhou Optical Communication Industry Alliance, introduced the important initiatives taken since the establishment of the alliance, the achievements made, and the future development direction of the alliance.

The successful holding of this conference has built a communication bridge between the government, industry associations, and enterprises. It has reached a consensus on the future direction of the Suzhou photonics industry among the three parties and has contributed to the development of Suzhou's photonics industry. In the future, Bozhon Precision Machinery will regularly join forces with various parties to organize more such events, offering suggestions for the construction of a new highland for the photonics industry in Suzhou.

The conference was covered by industry-related media such as Fiber Optics Online, Xunshi Communications, and the Jiangsu Laser Industry Technology Innovation Strategic Alliance.