The FastStar Series is a series of high-speed and high-precision Die Attach Equipments designed for multi-chip packaging. With our self-developed motion control technology, those equipments can achieve a high attachment accuracy of ±7μm@3σ and a high efficiency of up to 10,000 chips per hour (depending on the process). The FastStar Series adopts an open architecture and modular design, providing customers with the ability to customize on demand for maximum efficiency. They can handle up to 12-inch wafers and are compatible with various substrate transport methods, meeting packaging processes such as die attach, Flip chip, SiP, etc.
Application Industries consumer Electronics, Automotives, Display Panels, New Energy, etc.
Equipment accuracy | ±7μm@3σ |
Patch efficiency | 10000pcs/h |
Open architecture
Modular design
Providing customers with the ability to customize on demand for maximum efficiency
Compatible with various substrate transport methods
Handle up to 12-inch wafers
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Official video Number
No.666, Huxin Road, Wujiang District, Suzhou, Jiangsu, China 
