eutectic die bonder
eutectic die bonder

Automatic High-precision Eutectic Die Bonding Machine

The MicroStar Series is a series of leading multifunctional Die Attach Equipments with high efficiency (12~50s/pcs) and high precision (0.5-3μm) . This series serves functions of eutectic bonding, dipping glue bonding and Flip Chip bonding. It is also able to meet the needs of multi-chip bonding. Its modular design enables the equipment to have highly flexible manufacturing capability. Also, equipped with an intelligent calibration and data management system, the MicroStar Series is capable to trace and manage process.

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Parameters of Automatic High-precision Eutectic Die Bonding Machine


Patch efficiency

12~50s/pcs

Patch accuracy

±0.5~±3μm


Advantages of Automatic High-precision Eutectic Die Bonding Machine

  • Advantages of Automatic High-precision Eutectic Die Bonding Machine

    Eutectic bonding, dipping glue bonding and Flip Chip bonding.
    Meet the needs of multi-chip bonding

  • Advantages of Automatic High-precision Eutectic Die Bonding Machine

    Its modular design enables the equipment to have highly flexible manufacturing capability

  • Advantages of Automatic High-precision Eutectic Die Bonding Machine

    with an intelligent calibration and data management system, capable to trace and manage process.

Provide One-Stop Industrial Equipment Solutions
Add:
No.666, Huxin Road, Wujiang District, Suzhou, Jiangsu, China

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Automatic High-precision Eutectic Die Bonding Machine
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