Successful Delivery of Bozhon's Semi-Conductor International Project Marks a New Phase in the Globalization Process

The delivery of Bozhon's Xingwei series EH9721 semiconductor eutectic chip mounter is the first international project delivery case this year. The successful delivery of this project is enabled by the close and efficient cooperation of Bozhon's semiconductor project team in terms of equipment modular customization, production and manufacturing, which makes the node tasks of each stage completed with quality and quantity guaranteed, and finally the chip mounter is successfully delivered. .

Bozhon's Xingwei series EH9721 semiconductor eutectic chip mounter demonstrates excellent performance in the chip mounting accuracy, UPH, modular design and other aspects. With a comprehensive chip mounting accuracy of ±3μm, it is available to be applied in COC, COS, Gold Box and other mounting processes. It, by adopting nanoscale absolute double feedback gantry structure, multiple transfer stations (8), 2x2"/4x4" gel pack/waffle pack, and automatic loading and unloading of magazine cache, along with being equipped with horizontal turret sticker head, it can realize the dynamic automatic replacement of 12 nozzles during the mounting process, which significantly improves the speed and productivity of the equipment, enables application to a wider range of products, making it more suitable for mass production.

The successful delivery of the first batch of Bozhon's Xingwei series EH9721 semiconductor eutectic chip mounter international project marks a big step forward of the company in the globalization process. The company will also further strengthen its ability to provide global customers with full life cycle delivery of products, to meet the needs of those customers in optical modules, liDAR, RF devices and other segments for the mounting equipment and packaging solutions in the chip packaging process.

In the future, in terms of products, the company will continue to follow the market demand and focus on technological innovation and upgrade iteration of semiconductor process equipment, and pursuing product excellence; while at the business level, it will, by adhering to the strategy of giving considerations to both inside and outside and deep engagement in the market segmentation, continue to strengthen the construction of international teams, build a safe and reliable supply chain, and strengthen the exploration and practice of international development, offering more diversified services and product options for the company's global customers.